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PENSC

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Boron Nitride Insulation Gasket

Profile information:
basic information
Release time:
2019-06-29
Details

Grade

PENSC-B

Chemical structure BN%

%

99

Other components

 

no

Density

g/cm3

2.15

Hardness

HL

450

Flexural Strength

Mpa

95

Coefficient of thermal expansion(25℃-1200℃)

(10-6/K)

1~2

Thermal conductivity at 20℃

W/mk

35

MAX-Temperature of use

oxidizing

900℃

vacuum

1600℃

inert

1800℃

RT Resistivity

Ω.cm

>1014

PENSC

Features & Advantages

●Adopting international leading manufacturing boron nitride powder, Ensure the purity of materials and High temperature resistance.

●Adopting cold-isostatic pressing and bidirectional hot-pressing sintered technology, High density and longer lifetime.

●Stable and mature production technology and process, not use any binder, ensure material stability.

 

Typical Applications

●High purity BN crucibles for molten metal processing.

●Crucibles and setter plate for Nitride phosphors, Silicon Nitride, Aluminum nitride firing.

● Insulators and protective tubes for high-temperature furnaces

● Insulators for polysilicon ingot furnace

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